tin lead solder

Determination of phosphorus in tin-lead solder

锡铅焊料中磷的测定

Transducers used in professional loudspeaker systems, using tin-lead solder.

用于专业设备，含有铅锡焊料的积体电路。

The method is proved to be accurate, reliable, convenient and quick, absolutely suitable for the assaying of trace lead in silver tin solder.

方法准确、可靠、简便、快速，完全适用于银锡焊料中微量铅的检验。

In addition, the modified model not only can be used to describe the stress strain response at different strain rates very well, but also can be applied to predict the highly rate dependent multiaxial ratcheting behavior of eutectic tin-lead solder.

同时，修正后的模型不仅能准确描述锡铅钎料在不同应变率下的应力应变滞环，还可以较好的预测材料多轴棘轮效应的率相关性。

Extrusion Process and Design of segmental Die for Blank of Resin-cored Tin-lead Solder

锡铅焊丝坯挤压工艺及组合模具设计

ICP-AES determination of Cu Fe CD Zn Al and Bi as impurities in tin-lead solder

ICP-AES法测定锡铅焊料中铜铁镉锌铝铋

Production Practice of Tin-lead Solder Coating over Semibright Nickel Plating Technics

半光亮镍镀层涂覆铅锡焊料工艺生产实践